Hermetic Brazed Ceramic Header 

Miniature Format | High Dielectric Strength | Hermetic Brazed Assembly

This hermetic header integrates ceramic-to-metal sealing using both vacuum brazing and ceramic metallization to ensure maximum hermetic integrity and structural robustness.
Constructed with a high-purity alumina insulator and Alloy pins, the component is optimized for signal and power transmission in compact, harsh-environment packages.

The internal surfaces of the ceramic are metallized to enable strong adhesion and wetting during brazing, achieving an ultra-stable seal with low leak rates and high dielectric strength.

Key Features

  • Dual-process sealing: brazing + metallization for enhanced hermeticity
  • Miniature cylindrical format for tight packaging constraints
  • Excellent electrical insulation and thermal stability
  • Compatible with JEDEC and MIL-STD outlines
  • Customizable pin count, diameter, and plating (e.g., Ni/Au)
P/N PH08618-0000
  • Insulation resistance: > 100,000MΩ
  • Hermeticity: Better than 1x10⁻⁹ cc/sec @ 1 atm
  • Working temperature: from -65ºC up to +350ºC
  • Alumina ceramic 
  • Kovar
  • Nickel plaiting
  • Detonators and safety fuzes
  • High-G inertial sensors (IMUs)
  • Implantable medical electronics
  • Harsh-environment microelectronics
  • Vacuum or pressure-sealed modules

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