RF & Microelectronic Hermetic Enclosure

This RF hermetic enclosure is engineered for high-performance RF and microelectronic applications where reliability, shielding, and environmental protection are critical. Built using a robust Kovar housing and lid, the RF hermetic enclosure incorporates advanced glass-to-metal and brazing sealing technologies to ensure ultra-high hermeticity, superior thermal stability, and electrical insulation.

The 9-pin configuration (including a ground pin) and 19mil diameter pins offer a reliable interface for signal transmission while maintaining stringent leakage and resistance performance. The entire package is plated with gold, offering excellent corrosion resistance and conductivity for sensitive environments.

  • Insulation resistance: > 1000MΩ
  • Hermeticity:1×10⁻⁹ cc/sec @ 1 atm
  • Pin count: 9 (8 + 1 ground), 19mil diameter
  • Dimensions: ~24×24 mm (outer), optimized for large payload
  • Sealing configuration: Glass-to-metal (via brazing)
  • Body & Lid: Kovar (gold-plated)
  • Pins: Kovar
  • Sealing method: Brazed glass-to-metal hermetic sealing
  • Plating: Full-body gold plating
  • RF transmission modules
  • Microwave hybrid circuits
  • Aerospace & defense electronics
  • Hermetically sealed microelectronic packaging
  • Harsh-environment communications systems
P/N PH08652-0000

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