RF & Microelectronic Hermetic Enclosure

RF hermetic enclosure with gold-plated Kovar body and glass-to-metal sealing ensures durability and performance for microelectronic, aerospace, and defense systems.

Matched hermetic seals are engineered with materials that share closely matched coefficients of thermal expansion (CTE), such as Kovar and borosilicate glass. This ensures optimal thermal compatibility, minimizing stress during thermal cycling and enabling ultra-reliable sealing. These assemblies are ideal for mission-critical applications requiring ultra-low leak rates, long-term stability, and resistance to thermal fatigue — including aerospace, medical, and high-frequency electronics.

RF hermetic enclosure with gold-plated Kovar body and glass-to-metal sealing ensures durability and performance for microelectronic, aerospace, and defense systems.

Hermetic electronic package with glass-to-metal sealing and Kovar body ensures durability, insulation, and reliability for aerospace, defense, and high-voltage systems.

Hermetic TRM box assembly with Kovar or aluminum housing and glass-to-metal feedthroughs ensures durability and reliable connectivity for RF and microwave modules.

Hermetic SMP/SMPM RF feedthroughs in Kovar provide reliable high-frequency performance up to 65 GHz with hermetic sealing, thermal stability, and durability.

Hermetic brazed ceramic header with alumina insulator and alloy pins ensures robust sealing, high dielectric strength, and durability in compact systems.

27-pin ultra-hermetic connector delivers maximum sealing, durability, and leak-tight performance for critical systems in extreme environments.