Our TO (Transistor Outline) Series packages are JEDEC-compliant and designed for high-reliability electronics, providing robust encapsulation, excellent thermal management, and superior electrical performance. Utilizing glass-to-metal sealing, metallization, and precision welding technologies, these TO packages ensure long-term stability and protection for semiconductors, optoelectronics, and high-frequency components in defense, aerospace, power electronics, and industrial applications.
Customizable TO-5 Package Pin Configurations Our TO-5 hermetic packages are engineered for high-reliability applications requiring superior sealing, electrical insulation, and precision pin configurations. Designed using glass-to-metal sealing technology, these packages ensure outstanding hermeticity and long-term durability under challenging environmental conditions.…