Glass-to-Metal Sealing, Z-Top Cover
Designed for high-reliability electronic systems, this compact hermetic electronic package leverages advanced glass-to-metal sealing technology to ensure superior performance in harsh environments. Featuring a Z-top cover design, it offers a compact footprint of approximately 14mm x 14mm, optimized for dense electronics integration.
The enclosure and pins are both made of Kovar, enabling matched thermal expansion and reducing mechanical stress. Its rugged construction provides exceptional hermeticity, electrical insulation, and long-term durability — ideal for defense, aerospace, and high-voltage switching systems where mission-critical reliability is essential.
- Insulation resistance: > 1000MΩ
- Hermeticity: Better than 1×10⁻⁹ cc/sec @ 1 atm
- Pin Layout: 16 pins (Ø 0.012″ / 0.3 mm)
- Envelope Dimensions: ~14 mm × 14 mm
- Design: Z-top lid configuration for optimized footprint and integration
- Body & Pins: Kovar (ASTM F15 equivalent)
- Sealing Method: Glass-to-metal seal
- Lid: Z-top welded cover with pin feedthrough
- High-reliability defense electronics
- Aerospace power distribution modules
- Hermetically sealed switching devices
- Miniature signal routing systems
